| 摘要 |
PURPOSE:To improve work efficiency in terms of handling by a method wherein a rising enclosure is formed surrounding the upper surface of a ceramic base and a ceramic cap is accommodated inside the enclosure and fixed by molten solder glass to the enclosure. CONSTITUTION:A ceramic base 1 is a multilayer ceramic structure including metallized electrodes 2 for wiring and is provided with a rising enclosure 3 surrounding its upper surface. A silicon chip 6 is installed by an Au-Si eutectic solder to the ceramic base 1. Next, wiring regions on the silicon chip 6 are bonded to some of the metallized electrodes 2 belonging to the ceramic base 1 by Au or Al wirings 7. Further, in an enclosed region 3, a ceramic cap 5 is housed. Baking is accomplished in an oxidizing atmosphere for the adhesion of the ceramic cap 5 to the rising enclosure 3 by means of molten sealing solder glass 4. |
