| 摘要 |
PURPOSE:To prevent the deformation of a lead in resin molding sealing by forming a processing section for the lead in side-surface projection thickness larger than the plate thickness of the lead and parallel with the lead in at least resin-seal predetermined region in the lead. CONSTITUTION:A bending section 11 is shaped to a resin-seal predetermined region 105, to which resin molding sealing is executed, in a collector lead 101C supporting a chip head 111. The bending section is formed by executing bending on the formation of a lead frame, and the processing section shown in the figure takes a chevron. The processing section may be shaped in side-surface projection thickness (b) of 1.0mm as an example when the plate thickness (a) of the lead is 0.5mm. Said size is not limited in the shape of the processing section, and the shape of the processing section may be take a V shape, a U shape, an inverted U shape, etc. so far as the side-surface projection thickness is made larger (b>a) than plate thickness. |
