| 发明名称 |
Electronic module and method of manufacturing the same |
| 摘要 |
According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises surface structures. |
| 申请公布号 |
US9532459(B2) |
申请公布日期 |
2016.12.27 |
| 申请号 |
US201313964263 |
申请日期 |
2013.08.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Winter Frank;Geitner Ottmar;Nikitin Ivan;Hoegerl Juergen |
| 分类号 |
H05K1/18;H05K3/46 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic module comprising,
an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component; and a mold compound at least partially enclosing the electronic chip and the spacing element; wherein the spacing element comprises a lateral surface which is in direct contact with the mold compound and comprises at least one surface structure, wherein the lateral surface is substantially perpendicular to the main surface of the spacing element, and wherein the at least one surface structure constitutes a curved lateral surface. |
| 地址 |
Neubiberg DE |
