| 摘要 |
PURPOSE:To improve yield by mounting a meshy or striped cover consisting of a material conformable to a solder material to a substrate so as to cover a section fixed by the solder material. CONSTITUTION:A semiconductor laser 11 is fused and fastened to a substrate 13. An optical fiber 12, the periphery thereof is coated previously with a metal, is passed into a meshy or striped cover 14 and faced oppositely to the outgoing end of the semiconductor laser 11, and the meshy or striped cover 14 is made of a material conformable to a solder material, and fitted to the substrate 13. A light-receiving element 16 for monitoring an optical output is arranged behind the semiconductor laser 11, and fused to a thermo-electric-cooler 18, and these elements are mounted to a dual-in-line package 19. The meshy or striped cover composed of the material conformable to the solder material is set up, thus remarkably reducing movement in the case when the solder material is cured at a low temperature and fixed in the previously finely adjusted optical fiber, then improving yield. |
