发明名称 HEAT CONDUCTIVE SUBSTRATE
摘要 PURPOSE:To obtain a substrate having large junction strength between AlN substrate and metallize layer with less fluctuation and good yield by forming the surface of calcined AlN substrate with particular roughness and then forming thereon the metallize layer. CONSTITUTION:The surface of calcined AlN substrate 1 is formed with roughness (Rmax) of about 2-20mum and a metallize layer 2 is formed thereon. For instance, a green sheet, obtained by adding yttrium oxide of 3wt% to the aluminum nitride powder, milling and mixing them and thereafter adding a binder for the sheet formation by the doctor blade method, is calcined by heating it for 2hr AlN substrate 1 is sent to the horning process for obtaining the surface roughness (Rmax) of 5-15mum. Thereafter, the conductor paste mainly composed of Mo is printed and dried up. It is then sent to a vacuum furnace for calcination in order to obtain a metallized layer 2 in the thickness of 10mum. it is then cut with a diamond saw into specified small size. Thereafter, it is subjected to the N plating in the thickness of 2mum and Au plating in he thickness of 1.5mum.
申请公布号 JPS62224952(A) 申请公布日期 1987.10.02
申请号 JP19860067093 申请日期 1986.03.27
申请人 TOSHIBA CORP 发明人 IWASE NOBUO;ANZAI KAZUO;TAKAHASHI TAKASHI;SUGIURA YASUYUKI
分类号 H01L23/36;H01L23/15;H01L23/373;H05K1/03;H05K3/38 主分类号 H01L23/36
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