发明名称 MANUFACTURING METHOD OF IMAGING MODULE AND FLEXIBLE WIRING BOARD MOLDING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide technology for easily keeping a shape of a tip part of a flexible wiring board on which a solid state imaging device is mounted to be stable and for efficiently manufacturing an imaging module in which an electric cable and the solid state imaging device are electrically connected by using the flexible wiring board at a low cost.SOLUTION: A manufacturing method of an imaging module comprises: a device mounting process for mounting a solid state imaging device in a device mounting section 32 in a center of a slender flexible wiring board 30 in a longitudinal direction; a bend-forming process for bending parts on both sides to a back side opposite to a solid state imaging device-side via the device mounting section 32 of the flexible wiring board and forming extending sections 34a and 35a and connection piece parts 34b and 35b which extend from the extending sections; a bonding fixing process for charging an inner side surrounded by the extending sections and the device mounting section with resin and bonding and fixing the extending sections; and a cable connection process for connecting the electric cable to a terminal section on an outer face side of the respective connection piece parts.SELECTED DRAWING: Figure 1
申请公布号 JP2016171576(A) 申请公布日期 2016.09.23
申请号 JP20160073677 申请日期 2016.03.31
申请人 FUJIKURA LTD 发明人 SEKI TAKESHI;MATSUDA TAKEHIRO;YAMAGAMI KATSUYA;NAKATATE KENICHI
分类号 H04N5/225;A61B1/00;A61B1/04;G02B23/24 主分类号 H04N5/225
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