发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To improve deterioration in the resolution of a bit in the vicinity of the connecting part of a solid-state image pickup element, by using a substance having a refractive index of 1.49 or more in a visual light area, as the transparent insulating substrate of a solid-state image pickup element chip. CONSTITUTION:The substance having the refractive index of 1.49 or more, is used as transparent insulating substrates 113, and 114. Thereby, it is possible to adopt a process in which the manufacturing process of a transistor to form a driving circuit can be managed at around the maximum of 600 deg. temperature, even in case of manufacturing the solid-state image pickup element with built-in the driving circuit. Therefore, it is possible to use the substance having the refractive index of 1.49 or more, and the coefficient of thermal expansion larger than that of a quartz, such as a baruim boro-silicated glass, etc., as the substrates 113 and 114 of solid-state image pickup elements 102 and 103. By using the titled device, it is possible to improve the deterioration in the resolution of the bit in the vicinity of the solid-state image pickup element, and to obtain a solid-state image pickup device with no prominent consecutive part in an output signal.
申请公布号 JPS62292059(A) 申请公布日期 1987.12.18
申请号 JP19860136781 申请日期 1986.06.12
申请人 SEIKO EPSON CORP 发明人 HASEGAWA KAZUMASA
分类号 H01L27/146;H01L27/14;H04N1/028 主分类号 H01L27/146
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