| 摘要 |
The invention relates to a circuit board structure (21, 22), comprising at least one insulating layer (10), at least one conducting layer (11, 12), and at least one embedded component (1, 23 - 26) having contact pads (5) having an outer barrier layer (4), wherein at least two conducting tracks/conducting layers (19, 20) are connected to at least two connections (8; 8d, 8g, 8s) by means of vias (9; 9d, 9g, 9s) and each via (9; 9d, 9g, 9s) extends from a conducting track/conducting layer (11, 12) directly to the barrier contact layer (4; 4d, 4g, 4s) of the corresponding connection (8; 8d, 8g, 8s) of the component (1, 23 - 26). |
