LED MODULE, AND METHOD FOR MANUFACTURING LED MODULE

摘要

An LED module wherein a form is realized for resolving the problem of output loss of light that is discharged into the atmosphere. Specifically, an LED module in which an LED chip is sealed with sealing resin, wherein the LED module is configured such that the surface of the sealing resin is covered with a thin film, the thin film comprises a material that has a smaller linear expansion coefficient than the sealing resin, and the surface of the thin film is provided with an uneven surface, whereby light from the LED chip is multiply reflected.