发明名称 DEVICE FOR DISCHARGING DIE BONDING PASTE
摘要 PURPOSE:To prevent defective die bonding and to improve the working yield of paste by providing a capacitance sensor mechanism for detecting the position of the surface of the die bonding paste in a vessel on the outside of the vessel. CONSTITUTION:A small-bore discharge port 3 is provided to the vessel 1 contg. the die bonding paste 2,and the paste 2 is compressed and discharged to the outside from the discharge port 3. The position of the surface of the paste 2 in the vessel 1 is detected by the capacitance sensor mechanism 7 provided on the outside of the vessel 1. Consequently, the paste-contg. vessel can be exchanged at an early stage with a fresh one, the lost-motion in compressing an empty paste container is eliminated, defective die bonding is prevented, and further the working yield of paste can be improved.
申请公布号 JPS6362572(A) 申请公布日期 1988.03.18
申请号 JP19860206034 申请日期 1986.09.03
申请人 TOSHIBA CHEM CORP 发明人 OKUNOYAMA TERU
分类号 B05C5/00;H01L21/52 主分类号 B05C5/00
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