| 摘要 |
<p>A solder pot (16,80) for applying solder to exposed metallic surfaces in the undersides of circuit boards (78) carried by a conveyor (18) up a sloping path, the solder pot (16,80) being pivotally mounted to a post (88) and having jacking means (92) connected to the bottom of the solder pot, whereby the solder pot (16,80) may be raised or lowered as desired, and, in the lowered position, may be swung out from below the conveyer (18) for maintenance.</p> |
