| 摘要 |
PURPOSE:To make it possible to damp the electric resonance generated by a wiring conductor, a semiconductor capacitor and the like, to prevent the lowering of the operational margin due to resonance, and to prevent the generation of an erroneous operation by a method wherein, among the wiring conductors of the package to be used for semiconductor device, a resistance component is provided on the wiring to be connected to a power source. CONSTITUTION:The wiring conductor, to be connected to a power source terminal 1A and a ground terminal 1B, has secondary loop wirings 4A and 4B provided in parallel with the wiring conductor, mutual inductors 3A and 3B are formed between each of the wirings 4A and 4B. Resistors 5A and 5B are formed on the secondary loop wirings 4A and 4B, and a resistance component is substantially generated in the wiring conductor. The resistances 5A and 5B may be constituted in such a manner that a resistance is given to the whole circuit by forming the conductor of the secondary loop wirings 4A and 4B of material having a low conductivity.
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