| 摘要 |
<p>The invention is directed to a method of fabricating a pellicle cover assembly for use in a projection printing system for forming an image on a radiation sensitive wafer, the method comprising the steps of applying a thin uniform polymer film onto a polished surface of a substrate, curing the polymer film, making a cut around the circumference of the film, soaking the socoated substrate in water, attaching a peeling ring to the film surface, peeling off the film with the peeling ring, and epoxying this film to a suitable pellicle support ring, thereby forming said pellicle cover assembly.</p> |
