| 摘要 |
In this method, the represenation of stresses and/or deformations in bonding systems in building technology is effected by a photoelastic method. For this, an epoxy resin panel (8) which is provided on its face directed towards the bonding system (1) with a reflective layer (9) is applied on a face of the bonding system (1), or a pattern thereof, which is parallel to the main direction of stress, is planar or accessible, as a photoelastic layer. The epoxy resin panel (8) is bonded over a certain area to the face of the bonding system (1) by means of a bonding agent (7). The stresses and/or deformations are represented visually by means of an appropriate arrangement. <IMAGE>
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