发明名称 |
Focused convection reflow soldering method and apparatus. |
摘要 |
<p>An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air heating to achieve solder reflow at throughput speeds and soldering quality not heretofore achievable.</p> |
申请公布号 |
EP0279604(A2) |
申请公布日期 |
1988.08.24 |
申请号 |
EP19880301182 |
申请日期 |
1988.02.12 |
申请人 |
HOLLIS AUTOMATION INC. |
发明人 |
BAHR, KARL E.;SEDRICK, ARTHUR VICTOR, JR. |
分类号 |
B23K1/005;B23K1/012;H05K3/34 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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