| 摘要 |
PURPOSE:To prevent the breakdown of a semiconductor element in die bonding or due to temperature history thereafter, by dividing a tab into a peripheral loop part and a central island part, and indirectly mounting the semiconductor element on the island part through a bonding agent. CONSTITUTION:A tab 2 is divided into a peripheral loop part 2b and a central island part 2a. The island part 2a is connected to a part 2c of the loop part 2b so that the island part 2a is supported with the loop part 2b as a unitary body. A semiconductor element 1 is indirectly mounted on the island part 2a through a bonding agent 6. Meanwhile the element 1 is directly mounted on the element mounting surface of the loop part 2b or mounted through a gap part. Since the bonding of the element 1 and the tab 2 is carried out only at a part of the center of the element in this method, the stress yielded in the element is approximately equal to the value, which is yielded at the entire bonding part of the element 1 corresponding to the length of the bonded part. Therefore, cracks are not yielded in the element even if the element has a large size.
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