| 摘要 |
PURPOSE:To facilitate bonding work, assembling and check of characteristic of a semiconductor device by a method wherein belt type pads for bonding, U type outside terminals are provided on a square type heat radiating metal plate, and a temperature compensating plate is provided at the center part thereof. CONSTITUTION:The belt type pads 3, 31 for wire bonding are arranged along the edges of the square type heat radiating metal plate 1, the U type outside connecting terminals 4, 41 are provided respectively at one end part of the pads, the other U type outside connecting terminal 42 is provided at the circumferential part, while the temperature compensating plate 11 is arranged at the center part of the radiating plate 1, a transistor chip 5 is mounted thereon by soldering, it is bonded to the center parts of the bonding pads 3, 31 with wires 6, 61, a diode 51 is mounted on the radiating plate 1 as occasion demands, and is bonded to the pad 31 with a wire 62. Accordingly because the bonding area is large, bonding work, assembling and check of characteristic are facilitated. |
