| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for design base evaluation of a device.SOLUTION: A method for providing dynamic sampling by using a critical defect includes: specifying a plurality of critical pattern types on a wafer (702); determining a device risk level by using a calculated risk level and occurrence frequency about each of the specified critical pattern types (704); specifying one or more related excursions of the device (706); determining dynamic wafer selection in response to specification of one or more device excursions (708); and dynamically sampling at least a part of the specified critical pattern types (710).SELECTED DRAWING: Figure 7 |
