Distribution of gas over a semiconductor wafer in batch processing

摘要

A method and apparatus to evenly distribute gas over a wafer in batch processing. Several techniques are disclosed, such as, but not limited to, angling an injector to distribute gas towards a proximate edge of the wafer, and/or reducing the amount of overlap in the center of the wafer of gas from subsequent gas injections.

主权项

1. An apparatus for injecting gas onto a wafer, the apparatus comprising:
an arrangement comprising a plurality of wafers configured for batch processing; a plurality of injectors, wherein an outlet of each injector of the plurality of injectors is aligned with a plane of a corresponding wafer of the plurality of wafers and is configured to direct a corresponding portion of a gas substantially parallel to the plane of the corresponding wafer; and a plurality of rectification wings, wherein:
each pair of rectification wings from among the plurality of rectification wings is coupled to a corresponding injector of the plurality of injectors and is configured to deflect the corresponding portion of the gas away from a center of the corresponding wafer;at least one rectification wing from among the plurality of rectification wings extends along the plane of the corresponding wafer and overlaps at least a portion of the corresponding wafer; andthe outlet of each injector of the plurality of injectors is interposed between a corresponding pair of rectification wings from among the plurality of rectification wings.