| 摘要 |
The invention relates to a method for producing power components, using the T.A.B. technique for the conveyancing of the power chips and their connections. The method according to the invention is characterised in that the said chips 1 are transferred directly to a sole plate 3 simultaneously affording the role of heat dissipator and supply to the circuit, and the other connections are attached either to output tags 4, 5 originating from the same metal strip as the dissipator 3 or to the tracks of a printed circuit integral with the dissipator, using strip conveyancing of the dissipator 3 and of its connection tags or of the dissipator and of the associated printed circuit, and of the various insulators, and of the silicon chips 1 and of their connections 2. Application to the automobile industry. <IMAGE>
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