| 摘要 |
PURPOSE:To simply obtain a clean target without carrying out washing and drying stages by metallizing a target for sputtering by vacuum deposition before joining to a backing plate. CONSTITUTION:Cr and Cu are vacuum-deposited on a target member of a prescribed size with a vacuum deposition device to metallize the surface to be soldered and the target member is joined to a Cu backing plate with an In sheet in-between. After the metallizing, the target member is preferably heated, kept hot and soldered in vacuum or in an inert atmosphere of Ar or the like without using a flux. Since impurities or moisture does not adhere, washing and drying stages are made unnecessary and a clean target can simply be obtd. |
