发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad in which a surface of a polishing layer is softened in polishing.SOLUTION: There is provided a polishing pad having a polishing layer formed of a polyurethane resin, where the polishing layer is formed by curing a polyisocyanate compound, a polyol compound, a curing agent, and a polyurethane resin curable composition containing a fine hollow sphere, and has a surface layer portion which is softened at least in polishing while saturated.SELECTED DRAWING: None
申请公布号 JP2016196067(A) 申请公布日期 2016.11.24
申请号 JP20150076938 申请日期 2015.04.03
申请人 FUJIBO HOLDINGS INC 发明人 MIYASAKA HIROHITO;TATENO TEPPEI;KIRAKU YOSHIE;MATSUOKA RYUMA
分类号 B24B37/24;H01L21/304 主分类号 B24B37/24
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