发明名称 RESIN MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of improving maintainability.SOLUTION: In a resin molding die (10), a cavity piece (40) constituting the bottom surface of a cavity recessed part (18) into which a resin (R) is charged and a clamper (42) arranged in the outer periphery of the cavity piece (40) and constituting the inner wall surface of the cavity recessed part (18) are relatively and slidably constituted, and the resin molding die includes a mechanism of providing a seal material (43) in a gap between the cavity piece (40) and the clamper (42) to seal the resin (R). When the cavity piece (40) constitutes the entire bottom surface of the cavity recessed part (18), a holding member (45) being a part of the cavity piece (40) holding the seal material (43) can be replaced.SELECTED DRAWING: Figure 2
申请公布号 JP2016196146(A) 申请公布日期 2016.11.24
申请号 JP20150077418 申请日期 2015.04.06
申请人 APIC YAMADA CORP 发明人 IKEDA MASANOBU;SATO HISASHI
分类号 B29C33/72;B29C43/36;B29C45/26 主分类号 B29C33/72
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