| 摘要 |
PURPOSE:To change the polarity of a semiconductor laser pellet, and to prevent the alteration of the polarity of a lead for external connection by setting up a first electrode formed to a heat sink, a second electrode shaped onto the surface on the side reverse to a mounting surface in the semiconductor laser pellet and the lead for external connection for wire bonding to one of the electrodes. CONSTITUTION:A heat sink 2 on which a semiconductor laser pellet 1 is bonded is cemented to a copper block 5 in a stem by normal lead tin solder. The semiconductor laser pellet 1 and a bonding section 12 projected and shaped from the copper block 5 are connected by a gold wire 11, and a gold electrode 4 for the heat sink 2 and a lead 7 are connected by a gold wire 6. A photo-diode 10 for monitor and a lead 8 are connected by a gold wire 9, and these parts are covered with a cap with window glass from an upper section and sealed. When a semiconductor laser pellet 21 having polarity reverse to the semiconductor laser pellet 1 is mounted, the semiconductor laser pellet 21 and the lead 7 are connected by a gold wire 26, the gold electrode 4 for the heat sink 2 and the bonding section 12 are connected by a gold wire 31, and the polarity of the lead 7 is equalized. |
