| 发明名称 |
Desmear and etchback using NF3/O2 gas mixtures. |
| 摘要 |
<p>The present invention is directed to a method for plasma desmear and etchback of epoxy and polyimide materials from a multilayered or double sided printed circuit board using a plasma gas composition in the range of 20-50% NF3, the remainder being O2.</p> |
| 申请公布号 |
EP0308854(A1) |
申请公布日期 |
1989.03.29 |
| 申请号 |
EP19880115338 |
申请日期 |
1988.09.19 |
| 申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
BARKANIC, JOHN ANTHONY;REYNOLDS, DONNA MARIE |
| 分类号 |
C23F4/00;C09K13/08;C23G5/00;H05K3/00;(IPC1-7):H05K3/42 |
主分类号 |
C23F4/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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