| 摘要 |
PROBLEM TO BE SOLVED: To properly recognize that a center table is lifted to a position where a wafer can be carried into/out from the center table.SOLUTION: A cutting device (1) comprises: an annular table (7) which holds an outer periphery of a wafer (W); and a center table (8) capable of moving up and down relative to the annular table. A through hole (75) for guiding upward and downward movement of the center table is formed at the annular table. A shaft (80) which is housed in the through hole is provided at the center table. The center table is moved up by air supplied to the through hole, and the through hole is sealed by the shaft at a lifted end. The cutting device determines whether the center table is floated based on change in a flow rate or pressure of the air supplied to the through hole.SELECTED DRAWING: Figure 4 |
