| 摘要 |
PURPOSE:To decrease defective voids, and to manufacture a high-density printed circuit board through a rational process by a method wherein a through-hole is formed in a copper-clad laminated board, chemical copper plating is attached thinly, a fine circuit pattern is formed by a photo-resist, and second chemical copper plating in specified thickness is conducted only on a land and the through-hole. CONSTITUTION:A through-hole 3 is formed to a substrate on which a copper foil 2 is laminated, and a copper plating film 4a in film thickness of 0.5mum is shaped. An electrodeposition type UV resist 5 is applied onto the whole surface, the resists on surface circuit pattern sections 5a, through-hole sections 5b and a land are cured and resist patterns are shaped, a copper layer is removed through etching, using the resists 5a, 5b as masks, a circuit pattern is formed, and the resists are removed. Lastly, a cured film 6 consisting of a UV solder resist is left on the main surface of the substrate with the exception of a land section 7 and the through-hole 3, and a copper plating layer 4b is shaped onto the surfaces of the land section 7 and the through-hole 3. |
