发明名称 FINE GRINDING COMPOUND FOR WAFER
摘要 PURPOSE:To finish a wafer by grinding so as to have excellent smooth surface by making a fine grinding compound contain a specific polysaccharide high molecular compound. CONSTITUTION:When a wafer is ground, a polysaccharide high molecular compound formed by graft-polymerizing an acrylamide in a slurried compound improves drag reducing effect to form a laminar flow between an abrasive cloth and the wafer for preventing the occurrence of a turbulent flow. The surface of the ground wafer therefore becomes so smooth that its irregularity can not be found even by observation made through a differential interference microscope. In addition, the polysaccharide high molecular compound has high resisting ability against biochemical decomposition caused by a microorganism. Thus the above-mentioned compound can be steadily stored as an effective abrasive for long term.
申请公布号 JPH01177969(A) 申请公布日期 1989.07.14
申请号 JP19870333027 申请日期 1987.12.29
申请人 MITSUBISHI MONSANTO CHEM CO 发明人 SASAKI SHIGEO
分类号 H01L21/304;B24B37/00;C08J5/14;C09K3/14 主分类号 H01L21/304
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