| 摘要 |
PURPOSE:To contrive to enhance the strength of pellet through the twining of glass fibers with one another by a method wherein the specified glass fibers are added to resin composition for encapsulating electronic part at predetermined compounding ratio. CONSTITUTION:Hardener such as amines, which are solid at normal temperature, acid anhydride hardener and the like, filler such as silica powder, quartz glass and the like and 10-40wt.% of glass fibers, the mean fiber length of which is 100-500mum, the mean fiber length/filament diameter ratio of which is 10-50 on the basis of the usage of inorganic filler, are added to thermosetting resin consisting of epoxy resin, polyester resin, phenolic resin and the like. The resultant composition is homogeneously mixed with a kneader or a blender. Next, the resultant mixture is compacted in sheets or tablets or uniformly heated, mixed and, after that, solidified by cooling and finally mechanically ground into pellets. |
