发明名称 WIRING SUBSTRATE
摘要 <p>PURPOSE:To enable each parts to be inspected after fitting electrical parts by constituting 2 or more wires with a specific length performing electrical connection mutually for a plurality of common wirings. CONSTITUTION:A wirings group 2 is formed on a substrate with an insulation surface by a conductive material. At this time, the wiring group 2 is a lump of wiring group for one electrical parts 3 and is not connected to a wiring group 2' where the neighboring electrical parts are connected to. If the electrical parts are fitted to the wiring group 2 in this status, improper electrical parts are removed, new electrical parts are mounted, and inspection is performed again at this stage in the case of failure. Then, one part of this wiring group is covered to form an inner-layer insulation film 4, a wiring group 5 is formed with the same pitch as the wiring group over this insulation film 4, and the wiring groups 2 and 2' are mutually connected to complete a common wiring group. Thus, by performing inspection of electrical parts fitted to electrical circuit before the production is completed for judging whether they are appropriate or not, yield of the products can be improved.</p>
申请公布号 JPH01201984(A) 申请公布日期 1989.08.14
申请号 JP19880025911 申请日期 1988.02.05
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MASE AKIRA
分类号 H05K1/02;G09F9/00;H05K3/30;H05K3/40;H05K3/46 主分类号 H05K1/02
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