| 摘要 |
PURPOSE:To suppress air bubbles between adhesive boards at the time of adherence of ultrahigh density and high multilayer printed board by providing a plurality of bank members surrounding the outer peripheries of a plurality of hot plates, and detachably providing a plurality of packing members for sealing between the plurality of bank members. CONSTITUTION:A printed circuit board 27 of a material to be adhered, grasped by upper and lower jig plates 26a and 26b, is inserted between a lower hot plate and an upper hot plate. When hydraulic pressure is supplied from a hydraulic unit 28 to a main ram cylinder 2 and a counter cylinder 18 and heating and pressurizing operations are started, a vacuum packing 9 is simultaneously brought into contact with upper and lower banks 8, and the hot plates are vacuum evacuated by a vacuum evacuator 31 through a pipe 30 connected to vacuum evacuation holes 29 formed at the banks 8. Since the banks 8 surrounding the plates T are heat-insulated by a sheet packing 7, the packing 9 is not possibly thermally deteriorated. Since a vacuum adhesive chamber of small volume surrounding the plates T is composed of the banks 8, a material to be adhered adheres in a state of arriving at high vacuum at a high speed. |
