| 摘要 |
A process for manufacturing a pressure transducer of a pressure sensor is disclosed. Initially, a capacitive pressure transducer is formed by bonding a silicon diaphragm to a glass base such that the transducer produces different capacitances in response to different diaphragm deflections provided in response to sensed pressures. The sensitivity of the capacitive pressure transducer is adjusted by etching the silicon diaphragm while it is bonded to the base substrate in accordance with capacitance values of the transducer which were previously obtained at various predetermined pressures. In this manner, the thickness of the silicon diaphragm is selectively reduced to obtain an accurate desired sensitivity for the transducer and handling of very thin silicon diaphragms prior to their assembly to associated transducer bases is eliminated.
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