Solid image-pickup device with through hole passing through substrate

摘要

A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.

主权项

1. An imaging device comprising:
a semiconductor substrate having a first side as a light incident side and a second side opposite the first side; an image pick-up area disposed in the semiconductor substrate and having at least one light sensor; a through hole extending from the second side of the semiconductor substrate towards the first side; a transparent plate disposed along the first side; a cavity disposed between the transparent plate and the image pick-up area and disposed over the semiconductor substrate in an area of the semiconductor substrate without the through hole; an insulating film covering inner side surfaces of the through hole; and an electrically conductive material disposed in the through hole, wherein the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion, wherein a light-receiving surface of the image pick-up area and the first side of the semiconductor substrate are coplanar.