首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
RESIN SEALED SEMICONDUCTOR
摘要
申请公布号
JPH01276656(A)
申请公布日期
1989.11.07
申请号
JP19880106955
申请日期
1988.04.27
申请人
MITSUBISHI ELECTRIC CORP
发明人
MORI RYUICHIRO
分类号
H01L23/28;H01L23/50
主分类号
H01L23/28
代理机构
代理人
主权项
地址
您可能感兴趣的专利
HEAT-SEALING AQUEOUS COATING AGENT COMPOSITION AND HEAT-SEALING MULTILAYER STRUCTURE PREPARED BY COATING THE SAME
METHOD FOR DECREASING CYCLIC OLIGOMER CONTENT IN POLYESTER PRODUCT
URETHANE POLYOL COMPOSITION AND POLYURETHANE COMPOSITION
THERMOSETTING RESIN COMPOSITION
AGENT FOR PREVENTING DIABETES ONSET
TOOTHBRUSHING COMPOSITION
Cable puller with unique grip & method
Optical control unit and forming method therefor
Deck assembly for a self-propelled, walk-behind rotary lawn mower
CONNECTOR AND A CONNECTOR ASSEMBLY
Electrochemical mechanical processing using low temperature process environment
Method of improving copper interconnect of semiconductor devices for bonding
Coated nanotube surface signal probe
Signalling compounds for use in methods of detecting hydrogen peroxide
Method and system for computer-aided telecommunication and financial transactions
Surgical clips and methods for tissue approximation
Low profile multi-IC chip package connector
Terminating frame reception
Reverse optical mastering for data storage disks
Aryl phosphate derivatives of d4T having anti-HIV activity