| 摘要 |
<p>The present invention relates to a process for performing an adherent layer of component bonding adhesive on a semiconductor component to allow for its subsequent bonding to a dielectric support. The process involves the component to a pattern of component bonding adhesive that is detachably supported on a support film, the area of the pattern of component bonding adhesive being larger than the area of the component. The removal of the semiconductor component bring with it an adherent layer of component bonding adhesive sufficient in size to allow for later bonding of the component to the support.</p> |
