发明名称 |
FREMGANGSMAATE FOR FREMSTILLING AV MINIATYRISERT IMPEDANSTILPASSET LEDNINGSNETT. |
摘要 |
The Combi-Film-Hybrid (CFH) technology combines multilayer thick-film and thin-film on the same substrate to build high-density interconnections with integrated resistors for multi-chip modules. The technology is based on two or more multi-layer thick-film conductor layers with printable thick-film dielectric layers between the conductors including via-holes and with one or more thin-film signal interconnection layers on top of the thick-film structure using thick-film or glass between the last printed thick-film conductor and the thin-film, and with polyimide dielectric between the thin-film layers. All dielectric layers include via-holes. Each thin-film layer consists of a resistive film, a diffusion barrier film and a conductive film photopatterned to include thin-film resistors. Transmission lines for critical signals are built of thin-film and by using the underlaying thick-film layer as reference plane and hereby making possible design of high-density interconnections with characteristics impedance matched to the integrated circuits being used, to the package itself and outside interconnection. |
申请公布号 |
NO900229(D0) |
申请公布日期 |
1990.01.16 |
申请号 |
NO19900000229 |
申请日期 |
1990.01.16 |
申请人 |
MICRO ELECTRONICS - AME, A/S |
发明人 |
GROENLI, HANS BERNHARD |
分类号 |
H01L21/768;H01L23/12;H01L23/498;H01L23/538;H05K1/03;H05K1/09;H05K1/16;H05K3/46;(IPC1-7):H01L/ |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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