| 摘要 |
<p>The process comprises the steps… i) production of one layer by bringing a fibrous support material into contact with a curable mixture containing an epoxy resin having an average of at least two 1,2-epoxide groups per molecule or a mixture of these epoxy resins and a compound of the formula I or a mixture of these compounds …<IMAGE>… in which a and b, independently of one another, are 1 or 2, R<1> is a pi -arene, R<2> is a pi -arene or an indenyl or cyclopentadienyl anion, X<-> is an anion [LQm]<-> or an anion of a partially or perfluorinated aliphatic or aromatic sulphonic acid, L is P, As or Sb, Q is fluorine, or some of the radicals Q may alternatively be hydroxyl groups, and m corresponds to the valency of L increased by one,… ii) production of a layer sequence comprising at least two layer-form materials to be bonded to one another, of which at least one is a layer obtainable in accordance with step i) in which the curable material is essentially in unchanged form, and… iii) pressing said layer sequence at elevated temperature, the pressure and temperature being selected in such a manner that a liquid matrix resin is present at the beginning of this step, a drop in viscosity takes place initially so that virtually all included gases can escape from the layer sequence, and the increase in viscosity during the subsequent crosslinking reaction takes place so rapidly that the resin flowing out does not stick the compression mould together. …<??>The laminates obtainable in accordance with the invention are suitable for the production of circuit boards and insulation materials.</p> |
