| 摘要 |
<p>PURPOSE: To accurately join a chip, by arranging a die on a base body after coating the thin film of alloying metal to the surface of the base body and the die, forming the assembly of the die - the base body, applying compression to the die for the base body, forming a vacuum state around the assembly, and heating the assembly to an alloying temperature. CONSTITUTION: After a chip wafer provided with a memory die is cleaned, the thin film of gold is coated on a back surface. Then, by cutting the chip wafer to a required size, the respective chips 12 are formed. Also, after a silicon base body 14 coated with oxide is cleaned, the thin film of the gold is coated. The gold coated surfaces of the chips 12 and the base body 14 are cleaned with a solvent and deionized water, the dies 12 are arranged on the base body 14 and the compression is applied. Then, the assembly 16 of the chip - the base body is put inside an exhausted chamber 28 and heated to the alloying temperature for the time sufficient for forming the joint of eutectic alloy by a heating means 32. Thus, the joint without a gap is formed without performing a mechanical friction operation and many chips are accurately joined.</p> |
