FAN-OUT PACKAGE, FAN-OUT POP PACKAGE, AND MANUFACTURING METHOD THEREFOR

摘要

A fan-out POP manufacturing method of the present invention comprises the steps of: preparing an individual semiconductor chip comprising a contact metal; preparing a sacrifice substrate comprising an interconnect metal; mounting the individual semiconductor chip on the sacrifice substrate in a face-up shape such that the contact metal and the interconnect metal face the same direction; molding a protective member on the contact metal and the interconnect metal; exposing one side of the contact metal and one side of the interconnect metal by planarizing the protective member; and rewiring a top side for electrically connecting the contact metal and the interconnect metal to the outside. According to the configuration of the present invention, a process can be simplified and a yield can be improved.