摘要 |
PURPOSE:To reduce the cost and to improve the debugging efficiency by providing an in-circuit emulation interface circuit on a chip to control the input/output of the in-circuit emulation signals together with an input/output terminal for the same emulation signal added to the bottom surface of a packager. CONSTITUTION:An in-circuit emulation interface circuit 2 is connected to an external emulator via an input/output terminal for in-circuit emulation signal 8 which is set on the bottom surface of a package, e.g., at the center part right under a chip at a position except a peripheral part where a normal processor pin is prepared. Then the emulation is carried out. Thus the input/output terminal for the signal 8 can be set regardless of the normal microprocessor pin and furthermore can be connected to the emulator in a packing state. As a result, a high function and a high degree of integration can be secured for a microprocessor device containing the circuit 2. |