| 摘要 |
PURPOSE:To reduce a transferring distance to a minimum, and shorten processing time by selecting the most distant chip from the wafer center as the first chip, and selecting the chips of the second, the third, etc., in priority order which is previously determined based on the chips selected in advance. CONSTITUTION:A chip selecting means 31 selects a chip at the most distant position from the wafer center as a chip to be repaired firstly, out of chips having repairing fuse data. A priority determining means 32 performs the following process in accordance with a sequence previously determined by referring the selected chips; left chips are searched for up and down, the right and the left and on the periphery, and then the priority is determined by repeating the above process until all of the chips having repairing fuse data are selected. Thereby, repairing is practically enabled in the shortest transferring distance, and, as a result, the reduction of processing time is realized. |
