| 摘要 |
PURPOSE:To obtain a semiconductor device where the positioning accuracy of a semiconductor element is great, no unreasonable force is applied to a wire, and cracks are hard to occur in an element block by bending the tip part of two sets of lead which are extended oppositely each other toward a pedestal from the periphery of the pedestal and are provided in pair nearly at right angle for allowing them to abut on the pedestal from lateral direction. CONSTITUTION:In a semiconductor device where a pedestal 2 which is in one piece with a semiconductor element 1 is supported by leads 11-14 of a lead frame, two sets of leads 11, 12 and 13, 14 which are extended opposing each other from the periphery of the pedestal 2 toward the pedestal 2 and are provided in pairs are mounted, the direction of extension of one set of the leads 11, 12 and that of other set 13, 14 mutually cross at right angle, and a tip part 15 of those leads 11-14 is bent nearly at right angle so that it abuts on the pedestal 2 from the lateral direction, thus supporting the pedestal 2. For example, the first and second leads 11 and 12 are in pair and abut on the pedestal 2 from the lateral direction at mutually the opposite sides of the pedestal 2, and the first and second dummy leads 13 and 14 are in the same manner, thus supporting the pedestal 2 of those leads 11-14 from four directions.
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