| 摘要 |
<p>PURPOSE:To reduce the size of sealing resin by forming first and second electrode members substantially plainly in first and second sealing resins. CONSTITUTION:First and second electrode members are formed substantially plainly in first and second sealing resins. The first member 3 for mounting a light emitting diode 1 and the second member 4 for mounting a phototransistor are formed in the plane shape in the first resin 5 not to include a bent part. Thus, its horizontal size is set to 60% of a semiconductor optical coupler. Thus, the resin can be reduced in size.</p> |
