METHOD FOR IDENTIFYING SEMICONDUCTOR WAFER WITH BAR CODE PATTERN AND METHOD FOR MANUFACTURING SENICONDUCTOR DEVICE

摘要

The identifying method comprises the steps of depositing a metal layer on the semiconductor wafer, having a low transmission factor with respect to infrared rays and forming the bar code pattern with the metal layer. Light including infrared rays is irradiated onto a first side of the semiconductor wafer. The infrared rays transmitted through the semiconductor wafer and the bar code pattern of the metal layer are received on a second side of the semiconductor wafer. The semiconductor wafer is identified by decoding the received signal. The second step includes forming the bar code pattern on the front side of the semiconductor wafer. The infrared rays are irradiated onto the back side of the semiconductor wafer.