发明名称 |
SEMICONDUCTOR POWER MODULE WITH INTEGRATED HEAT PIPE |
摘要 |
<p>A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from the semiconductor power component at the heating zone over an area of the condensation zone being larger than the given area, a highly heat-conducting ceramic base plate having two metallized sides, and a frame vacuum-tightly interconnecting the carrier plate and the base plate forming the vapor space of the heat pipe therebetween.</p> |
申请公布号 |
EP0191419(B1) |
申请公布日期 |
1990.11.28 |
申请号 |
EP19860101543 |
申请日期 |
1986.02.06 |
申请人 |
ASEA BROWN BOVERI AKTIENGESELLSCHAFT |
发明人 |
WESSJOHANN, HANS GEORG, DR., DIPL.-PHYS.;NEIDIG, ARNO |
分类号 |
H01L23/427 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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