| 摘要 |
PURPOSE:To prevent the direct adhesion of dust while also obviating the error of the detection of an origin due to fouling by covering the upper section of the origin mark of a coordinate system positioning a wafer stage, on which a semiconductor substrate is fixed, with a transparent substance in a reduction projection type exposure device transferring a pattern on a mask onto the semiconductor substrate through a reduction projection lens. CONSTITUTION:Structure in which a columnar transparent plate 3 having the same diameter as an origin mark base 2 is closely stuck to the upper sections of origin marks 1 formed by shaping stepped sections to the origin mark base 2 composed of quartz, etc., in order to prevent the fouling of dust, etc., is formed. Accordingly, the direct adhesion of dust onto the origin marks 1 is prevented while an adverse effect on the detection of an origin can be reduced remarkably because the height of the origin marks 1 and dust differs even when the fouling of dust, etc., attaches on the flat top face of the columnar transparent plate 3. |
