| 摘要 |
<p>PURPOSE:To obtain an aluminum nitride multilayer circuit board having small conductor resistance by adding specific amount of Ca or Ca and Y baking assistants to aluminum nitride, setting a green sheet board in which W paste is interconnected in multilayers as a conductor material in a NB sealed vessel, and baking it. CONSTITUTION:0.5-10.0 pts.wt. of Ca or Ca and Y baking assistants are added to 100 pts.wt. of aluminum nitride, a green sheet board 4 in which W paste is laid out in multilayers as a conductor material is set in a BN sealed vessel 1, and baked at 1550-1750 deg.C. Thus, an aluminum nitride multilayer circuit board having high density, high thermal conductivity and low conductor resistance can be obtained.</p> |
