3D package with through substrate vias

摘要

A package, comprising a substrate having electrical devices disposed at a first side of the substrate, vias extending from the first side of the substrate to a second side of the substrate opposite the first side and metallization layers disposed on the first side of the substrate. Contact pads are disposed over the first metallization layers and a protection layer is disposed over the contact pads. Post-passivation interconnects are disposed over the protection layer and extend to the contact pads through openings in the protection layer. Connectors are disposed on the PPIs and a molding compound extends over the PPIs and around the connectors.

主权项

1. A device comprising:
a first integrated circuit die including a transistor formed at a top surface of the first integrated circuit die and a conductive through via extending from the top surface to a bottom surface of the first integrated circuit die; a metallization layer over the top surface of the first integrated circuit die; contact pads disposed over the metallization layer; a protection layer disposed over the contact pads; a first redistribution layer (RDL) disposed over the protection layer and extending to the contact pads through openings in the protection layer; first connectors disposed over/on the first RDL; a molding compound over the first RDL and around the first connectors; a second RDL disposed on the bottom surface of the first integrated circuit die and electrically connected to the conductive through via; and a second integrated circuit die mounted to the bottom surface of the first integrated circuit die and electrically connected to the second RDL.