发明名称 MANUFACTURE OF LED
摘要 PURPOSE:To prevent a shift in positions between an LED body and a light emitting chip by a method wherein a guide of a lead frame is fitted into a guide hole of a cavity and the LED body is resin-molded. CONSTITUTION:A guide 7 protruding from an LED body 1 is formed at the head of a lead frame 2, while a guide hole 6 for permitting the guide 7 to be fitted into is provided on the bottom of a cavity of a die in which the LED body 1 is to be resin-molded. The head 7 of the lead frame 2 is inserted into the guide hole 6 provided on the cavity bottom 5 of the die, and resin is injected into the cavity 4 to mold the LED body. That is, since the guide hole 6 has been highly precisely worked on a reference position where the lead frame 2 should be inherently located, the lead frame 2 may not shift nor tilt due to pressure at the time of resin injection, vibration caused during operation and failure in contact. When the lead frame 2 itself is subjected to deformation, it can be corrected and fixed along with a support 8 of a leg. Thus a light emitting chip 3 to be mounted on a lead frame 2 can highly precisely be positioned with respect to the LED body.
申请公布号 JPH03109781(A) 申请公布日期 1991.05.09
申请号 JP19890248472 申请日期 1989.09.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ITO TAKAYASU;KANBE YOSHIAKI
分类号 H01L33/56;H01L33/62 主分类号 H01L33/56
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