| 摘要 |
PURPOSE:To enable a multilayer printed-circuit board to be produced with improved yield by a single method by combining the thin-film method and the thick-film method. CONSTITUTION:A YBa2Cu2O7, delta is formed by 1mum on a TiSrO3 substrate by the Rf magnetron sputter method for forming a thin-film first superconductive layer. Then, a 100mum thick insulation layer pattern 5 is screen-printed by a high melting-point glass material and it is tentatively burnt. Then, a 100mum thick second superconductive layer 4 is printed along with a through-hole 3 by using a YBa2O7, delta powder paste with an average grain diameter of 10mum, and calcined within oxygen environment, thereafter it is cooled within the same environment at a rate of 10 deg.C/hour or lower for introducing sufficient oxygen into the superconductive layer, thus enabling a superconductive multilayer wiring board with a critical temperature which is equal to or higher than the liquid nitrogen temperature to be produced by a simple method combining the thin-film and thick-film methods with improved yield. |
